用以固化框胶的固化装置

Solidification device for solidifying frame glue

Abstract

本发明公开了一种用以固化框胶的固化装置,包括供胶装置以及四固化光源。供胶装置沿着基板的四周移动,以于基板的四周涂布框胶。四固化光源分别设置于供胶装置的前后左右四侧,且四固化光源跟随供胶装置沿着基板的四周移动。在供胶装置于基板上涂布框胶后,四固化光源选择性地发出固化光线,以固化框胶。因此,供胶装置在基板上任意位置涂布框胶时,都可实时被四固化光源的其中之一所发出的固化光线照射到。本发明的用以固化框胶的固化装置设计简单,可有效降低设备的设置成本。
The invention discloses a solidification device for solidifying frame glue, comprising a glue feeding means and four solidifying light source. The glue feeding means is moved along the periphery of the substrate, and the frame glue is coated on the periphery of the substrate. The four solidifying light source are respectively disposed at the front, rear, left and right sides of the glue feeding means, and are moved along the periphery of the substrate with the glue feeding means. After the frame glue is coated on the periphery of the substrate, the four solidifying light source selectively send out solidifying light to solidify the frame glue. Accordingly, when the frame glue is coated on any positions of the substrate, the glue feeding means can be irradiated by the solidifying light emerging from any one of the four solidifying light source. The solidification device for solidifying frame glue is simple in design and is capable of effectively reducing device cost.

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Cited By (1)

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    CN-104668151-AJune 03, 2015东莞新科技术研究开发有限公司Treatment device and method for semiconductor