电子部件

Abstract

在插入器(12)的绝缘性基板(120)中的安装层叠陶瓷电容器(11)的一个主面,形成有上表面电极(1211、1221)。绝缘性基板(120)从与主面正交的方向看去,被形成为与被安装的层叠陶瓷电容器(11)大致相同形状,安装层叠陶瓷电容器(11)以使长度方向大致一致。在绝缘性基板(120),在从与主面正交的方向看去的四个角形成有具备连接电极(401-404)的切口部(Cd11、Cd12、Cd13、Cd14)。利用这些连接电极(401-404),将一个主面的上表面电极(1211、1221)分别连接到与电路基板(20)相连的形成于另一个主面的下表面电极(1212、1222)。
Upper-surface electrodes (1211, 1221) are formed on one principal surface, of an insulating substrate (120) of an interposer (12), on which a multilayer ceramic capacitor (11) is installed. The insulating substrate (120) is formed to substantially the same shape as the installed multilayer ceramic capacitor (11) when viewed from the direction orthogonal to the principal surface, and the multilayer ceramic capacitor (11) is installed so that the length directions substantially match. Cutout sections (Cd11, Cd12, Cd13, Cd14) provided with connecting electrodes (401-404) are formed on four corners of the insulating substrate (120) when viewed from the direction orthogonal to the principal surface. The connecting electrodes (401-404) connect the upper-surface electrodes (1211, 1221) on one principal surface to respective lower surface electrodes (1212, 1222) formed on the other principal surface, the lower surface electrodes connecting to a circuit board (20).

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